Package Design Engineer

Description

About us

You may not realize it, but Teledyne enables many of the products and services you use every day. Teledyne provides enabling technologies to sense, transmit and analyze information for industrial growth markets, including aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, energy, medical imaging and pharmaceutical research.

Teledyne e2v is recruiting a Package Design Engineer, this position can be based at our Saint‑Egrève site (near Grenoble, France) or at Teledyne Anafocus in Seville (Spain).

Teledyne e2v Semiconductors SAS, based in Saint‑Egrève (near Grenoble), has been a recognized semiconductor specialist for more than 70 years. Our 400‑employee site brings together research and development teams, production workshops, and support functions for two main business areas:

• Machine Vision Sensors (MVS) for image sensors, dental sensors, and cameras.
• High-Performance and High-Reliability semiconductor products: microprocessors, memories and high‑speed data converters.

Teledyne Anafocus, located in the Seville Tech Park, is a center of excellence in CMOS image sensor and vision‑on‑chip design, with a highly skilled engineering team and a strong innovation culture. Now fully integrated within Teledyne e2v, the site develops next‑generation imaging technologies for industrial, scientific, medical and surveillance applications.

Job description

The Package Design Engineer leads the complete design flow of advanced microelectronic packages—translating customer needs into technical specifications, defining the solution, and ensuring successful routing and design reviews.

As the key technical interface, the Package Design Engineer works closely with packaging vendors and assembly houses throughout the project lifecycle. The role also involves monitoring emerging technologies and leading R&D or continuous‑improvement initiatives to shape future generations of imaging packages.

What You’ll Do

Management of the full design flow of organic and ceramic multi-layers microelectronics packaging (BGA, PGA, CLCC, CQFP, WLCSP):

• Identify customers’ needs.
• Devise a solution and a specification.
• Interact with packaging manufacturers to obtain a solution and a quote all along the design process.
• Interacting with project teams (sensor designers, project manager…)
• Implement the design + routing of the package in accordance with the constraints and timing as originally defined.
• Conduct, electrical, thermal and mechanical simulations when necessary.
• Conduct DRC checks in accordance with e2v methodologies.
• Conduct different design reviews including the final one before ordering the package.
• Assume the role of design expert with respect to assembly houses (assembly instructions…)

Ensure technical interface with package vendors and assembly houses:

• Guide technical reviews with package vendors.
• Technical Identification and evaluation of new vendors.

Technology monitoring :

• Maintain a technology watch on future generations of imaging packages.
• Identify and lead R&D or continuous improvement projects on these technologies.

Why Join Us

A strong customer focused individual (active listening and customers satisfaction), team-worker, with ability to adapt and communicate on subjects requiring rigor.

Autonomy to plan for results & continuous improvement are necessary qualities for this position

What You Need to be successful in this role

• Background in microelectronics, in electronics (preferred), material science or micromechanics
• First confirmed experience in packaging design.
• Specific experience in imaging and/or assembly would be a serious plus.
• Mastering of package design flow: specification, identifying solutions, design, validation.
• Mastering packaging layout meeting signal/power integrity aspects (under Cadence APD or equivalent).
• Knowledge basic mechanical design (Solid works or equivalent).
• Experience in technical management of package vendors and assembly houses.

A strong advantage would be

• Knowledge in electrical modelisation (parasitic extraction under Cadence Xtract IM, Spice, Ansys).
• knowledge in thermal simulations (Ansys workbench, Solid works).
• An experience in system and sub-system development.

A good level of English (B2 minimum) and French both oral and written. Spanish would be a plus.

What We Offer

At Teledyne e2v, you join a team where innovation, human values and work‑life balance come together:

Work on cutting‑edge technological projects with high impact

Join an innovation‑driven environment in the Grenoble ecosystem, awarded 2026 European Capital of Innovation

Evolve within a human‑scale site where your contribution truly matters

Build your career through multiple development paths: technical expertise, project management, and international exposure within the Teledyne group (15,000 employees worldwide)

Enjoy a structured onboarding program with a dedicated mentor

Work in an attractive and flexible environment: teleworking agreement and real work–life balance

Join a company deeply committed to QHSE/CSR goals (2025–2030): “40 by 40” carbon plan, Gold‑level Pro Vélo certification, support to Handisport and Adapted Sport leagues

Be part of a culture built on respect, integrity, responsibility and citizenship

Evolve in a company committed to gender equality (score: 93/100)

Live in a unique Alpine environment, combining technological excellence with excellent quality of life

For more information about Teledyne e2v Semiconductors SAS, visit:

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

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